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? 1 ? ICX267AL 20 pin dip (plastic) description the ICX267AL is a diagonal 8mm (type 1/2) interline ccd solid-state image sensor with a square pixel array and 1.45m effective pixels. progressive scan allows all pixels' signals to be output independently. also, the adoption of high frame rate readout mode supports 30 frames per second. this chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. high resolution and high low dark current are achieved through the adoption of had (hole-accumulation diode) sensors. this chip is suitable for applications such as electronic still cameras, pc input cameras, etc. features ? progressive scan allows individual readout of the image signals from all pixels. high horizontal and vertical resolution (both approx. 1024tv -lines) still image without a mechanical shutter. supports high frame rate readout mode (effective 512 lines output, 30 frames/s) square pixel horizontal drive frequency: 28.636mhz no voltage adjustments (reset gate and substrate bias are not adjusted.) high resolution, high color reproductivity, high sensitivity, low dark current low smear, excellent antiblooming characteristics continuous variable-speed shutter device structure interline ccd image sensor image size: diagonal 8mm (type 1/2) total number of pixels: 1434 (h) 1050 (v) approx. 1.50m pixels number of effective pixels: 1392 (h) 1040 (v) approx. 1.45m pixels number of active pixels: 1360 (h) 1024 (v) approx. 1.40m pixels (7.959mm diagonal) chip size: 7.60mm (h) 6.20mm (v) unit cell size: 4.65m (h) 4.65m (v) optical black: horizontal (h) direction: front 2 pixels, rear 40 pixels vertical (v) direction: front 8 pixels, rear 2 pixels number of dummy bits: horizontal 20 vertical 3 substrate material: silicon diagonal 8mm (type 1/2) progressive scan ccd image sensor with square pixel for b/w cameras 2 40 h v 2 8 pin 1 pin 11 optical black position (top view) ? wfine ccd is a registered trademark of sony corporation. represents a ccd adopting progressive scan, primary color filter and square pixel. e01y03b43 sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits.
? 2 ? ICX267AL use restriction notice (december 1, 2003 ver.) this use restriction notice ("notice") is for customers who are considering or currently using the ccd products ("products") set forth in this specifications book. sony corporation ("sony") may, at any time, modify this notice which will be available to you in the latest specifications book for the products. you should abide by the latest version of this notice. if a sony subsidiary or distributor has its own use restriction notice on the products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. you should consult a sales representative of the subsidiary or distributor of sony on such a use restriction notice when you consider using the products. use restrictions the products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by sony from time to time. you should not use the products for critical applications which may pose a life- or injury- threatening risk or are highly likely to cause significant property damage in the event of failure of the products. you should consult your sony sales representative beforehand when you consider using the products for such critical applications. in addition, you should not use the products in weapon or military equipment. sony disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. design for safety sony is making continuous efforts to further improve the quality and reliability of the products; however, failure of a certain percentage of the products is inevitable. therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social damage as a result of such failure. export control if the products are controlled items under the export control laws or regulations of various countries, approval may be required for the export of the products under the said laws or regulations. you should be responsible for compliance with the said laws or regulations. no license implied the technical information shown in this specifications book is for your reference purposes only. the availability of this specifications book shall not be construed as giving any indication that sony and its licensors will license any intellectual property rights in such information by any implication or otherwise. sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third-party rights due to the same. it is therefore your sole legal and financial responsibility to resolve any such problems and infringement. governing law this notice shall be governed by and construed in accordance with the laws of japan, without reference to principles of conflict of laws or choice of laws. all controversies and disputes arising out of or relating to this notice shall be submitted to the exclusive jurisdiction of the tokyo district court in japan as the court of first instance. other applicable terms and conditions the terms and conditions in the sony additional specifications, which will be made available to you when you order the products, shall also be applicable to your use of the products as well as to this specifications book. you should review those terms and conditions when you consider purchasing and/or using the products.
? 3 ? ICX267AL block diagram and pin configuration (top view) pin no. pin no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 pin description note) : photo sensor ... ... ... ... note) v out gnd nc gnd nc nc v 3 v 2b v 2a v 1 v dd gnd sub nc c sub nc v l rg h 1 h 2 vertical re gister horizontal register 11 12 13 14 15 16 17 18 19 20 10 9 8 7 6 5 4 3 2 1 ? 1 dc bias is generated within the ccd, so that this pin should be grounded externally through a capacitance of 0.1f. symbol v dd gnd sub nc c sub nc v l rg h 1 h 2 symbol v 1 v 2a v 2b v 3 nc nc gnd nc gnd v out description supply voltage gnd substrate clock substrate bias ? 1 protective transistor bias reset gate clock horizontal register transfer clock horizontal register transfer clock description vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock gnd gnd signal output
? 4 ? ICX267AL absolute maximum ratings ? 1 +24v (max.) when clock width < 10s, clock duty factor < 0.1%. +16v (max.) is guaranteed for turning on or off power supply. item v dd , v out , rg ? sub v 2a , v 2b ? sub v 1 , v 3 , v l ? sub h 1 , h 2 , gnd ? sub c sub ? sub v dd , v out , rg, c sub ? gnd v 1 , v 2a , v 2b , v 3 ? gnd h 1 , h 2 ? gnd v 2a , v 2b ? v l v 1 , v 3 , h 1 , h 2 , gnd ? v l voltage difference between vertical clock input pins h 1 ? h 2 h 1 , h 2 ? v 3 against sub against gnd against v l between input clock pins storage temperature operating temperature ?40 to +10 ?50 to +15 ?50 to +0.3 ?40 to +0.3 ?25 to ?0.3 to +18 ?10 to +18 ?10 to +15 ?0.3 to +28 ?0.3 to +15 to +15 ?16 to +16 ?16 to +16 ?30 to +80 ?10 to +60 v v v v v v v v v v v v v c c ? 1 ratings unit remarks
? 5 ? ICX267AL clock voltage conditions readout clock voltage vertical transfer clock voltage horizontal transfer clock voltage reset gate clock voltage substrate clock voltage v vt v vh02a v vh1 , v vh2a , v vh2b , v vh3 v vl1 , v vl2a , v vl2b , v vl3 v 1 , v 2a , v 2b , v 3 | v vl1 ? v vl3 | v vhh v vhl v vlh v vll v h v hl v rg v rglh ? v rgll v rgl ? v rglm v sub 14.55 ?0.05 ?0.2 ?8.4 7.6 4.75 ?0.05 3.0 22.15 15.0 0 0 ?8.0 8.0 5.0 0 3.3 23.0 15.45 0.05 0.05 ?7.6 8.4 0.1 0.9 1.3 1.0 0.9 5.25 0.05 5.5 0.4 0.5 23.85 1 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 v vh = v vh02a v vl = (v vl1 + v vl3 )/2 high-level coupling high-level coupling low-level coupling low-level coupling low-level coupling low-level coupling v v v v v v v v v v v v v v v v bias conditions power supply voltage protective transistor bias substrate clock reset gate clock item v dd v l sub rg symbol 15.0 ? 1 ? 2 ? 2 min. v unit remarks typ. max. ? 1 v l setting is the v vl voltage of the vertical transfer clock waveform, or the same power supply as the v l power supply for the v driver should be used. ? 2 do not apply a dc bias to the substrate clock and reset gate clock pins, because a dc bias is generated within the ccd. dc characteristics 14.55 15.45 power supply current item i dd symbol 7.7 min. unit remarks typ. max. ma item symbol min. typ. max. unit waveform diagram remarks
? 6 ? ICX267AL clock equivalent circuit constant c v1 c v2a c v2b c v3 c v12a , c v2b1 c v2a3 , c v32b c v13 c h1 , c h2 c hh c rg c sub r 1 r 2a , r 3 r 2b r gnd r h r rg symbol capacitance between vertical transfer clock and gnd capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor reset gate clock series resistor item min. 2200 3300 3300 3300 1200 1200 2200 47 100 8 680 36 56 56 30 15 20 typ. max. pf pf pf pf pf pf pf pf pf pf pf ? ? ? ? ? ? unit remarks horizontal transfer clock equivalent circuit vertical transfer clock equivalent circuit v 1 c v12a v 2a v 2b v 3 c v32b c v2a3 c v2b1 c v13 c v1 c v2a c v2b c v3 r gnd r 2b r 1 r 3 r 2a h 1 h 2 c h1 c h2 c hh r h r h reset gate clock equivalent circuit r rg rg c rg
? 7 ? ICX267AL drive clock waveform conditions (1) readout clock waveform (2) vertical transfer clock waveform v vh = v vh02a v vl = (v vl01 + v vl03 )/2 v vl3 = v vl03 v 1 v 3 v 2a , v 2b 100% 90% 10% 0% tr tf 0v twh m 2 m v vt v vh1 v vhh v vh v vhl v vlh v vl1 v vl01 v vl v vll v vh3 v vhh v vh v vhl v vlh v vl03 v vl v vll v vlh v vl2a , v vl2b v vll v vl v vh v vhh v vh02a , v vh02b v vh2a , v vh2b v vhl v v1 = v vh1 ? v vl01 v v2a = v vh02a ? v vl2a v v2b = v vh02b ? v vl2b v v3 = v vh3 ? v vl03 v t note) readout clock is used by composing vertical transfer clocks v 2a and v 2b .
? 8 ? ICX267AL (3) horizontal transfer clock waveform cross-point voltage for the h 1 rising side of the horizontal transfer clocks h 1 and h 2 waveforms is v cr . the overlap period for twh and twl of horizontal transfer clocks h 1 and h 2 is two. (4) reset gate clock waveform v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v rg = v rgh ? v rgl . negative overshoot level during the falling edge of rg is v rglm . (5) substrate clock waveform h 1 h 2 10% 90% twh tf tr twl v hl v h two v cr v h 2 rg waveform v rglh v rgh v rgl v rgll v rglm tr twh twl tf v rg point a 100% 90% 10% 0% v sub (a bias generated within the ccd) tr tf twh m 2 m v sub
? 9 ? ICX267AL clock switching characteristics min. twh typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf 3.2 10 10 4 3.4 12.5 12.5 8 3.9 10 10 12.5 12.5 24 0.5 5 5 0.01 0.01 2 7.5 7.5 0.5 15 2 0.5 5 5 0.01 0.01 450 7.5 7.5 0.5 unit s ns ns s ns s remarks during readout ? 1 ? 2 when draining charge item readout clock vertical transfer clock during imaging during parallel-serial conversion reset gate clock substrate clock horizontal transfer clock ? 1 when vertical transfer clock driver cxd1267an 2 is used. ? 2 tf tr ? 2ns, and the cross-point voltage (v cr ) for the h 1 rising side of the h 1 and h 2 waveforms must be at least v h /2 [v]. spectral sensitivity characteristics (excludes lens characteristics and light source characteristics) symbol v t v 1 , v 2a , v 2b , v 3 h 1 h 2 h 1 h 2 rg sub min. two typ. max. 810 unit ns remarks item horizontal transfer clock symbol h 1 , h 2 1.0 0.8 0.6 0.4 0.2 0 400 500 600 700 wave length [nm] relative response 800 900 1000
? 10 ? ICX267AL progressive scan readout mode high frame rate readout mode high frame rate readout two pixels addition ? 1 image sensor characteristics (ta = 25c) sensitivity saturation signal smear video signal shading dark signal dark signal shading lag s vsat vsat2 vsat4 sm shg vdt ? vdt lag 360 450 380 380 450 0.001 0.002 0.0025 0.005 20 25 8 2 0.5 mv mv mv mv % % % % mv mv % 1 2 2 2 3 3 4 4 5 6 7 1/30s accumulation progressive scan readout, high frame rate readout two pixels addition high frame rate readout mode zone 0 and i zone 0 to i i ' ta = 60c, 15 frames/s ta = 60c, 15 frames/s ? 2 item symbol min. typ. max. unit measurement method remarks ? 1 vsat4 is the saturation signal amount at two pixels addition, and it is 190mv per one pixel. v sub internal generation value ensures 190mv per one pixel of the saturation signal amount in high frame rate two pixels addition mode. ? 2 eliminates the dark signal shading in the vertical direction by the high-speed transfer of the vertical register. ta = 60c zone definition of video signal shading measurement system note) adjust the amplifier gain so that the gain between [ ? a] and [ ? b] equals 1. 16 v 10 16 8 8 ignored region effective pixel region zone 0, i zone ii , ii ' v 10 h 8 h 8 1392 (h) 1040 (v) ccd c.d.s amp ccd signal output [ ? a] signal output [ ? b] s/h
? 11 ? ICX267AL readout modes the diagram below shows the output methods for the following three readout modes. 9 (v2a) 8 (v2b) 7 (v2b) 6 (v2a) 5 (v2a) 4 (v2b) 3 (v2b) 2 (v2a) 1 (v2a) v out 9 (v2a) 8 (v2b) 7 (v2b) 6 (v2a) 5 (v2a) 4 (v2b) 3 (v2b) 2 (v2a) 1 (v2a) v out 9 (v2a) 8 (v2b) 7 (v2b) 6 (v2a) 5 (v2a) 4 (v2b) 3 (v2b) 2 (v2a) 1 (v2a) v out progressive scan mode high frame rate readout mode high frame rate readout two pixels addition mode 1. progressive scan mode in this mode, all pixels signals are output in non-interlace format in 1/15s. the vertical resolution is approximately 800 tv-lines and all pixels signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing. 2. high frame rate readout mode all effective areas are scanned in approximately 1/30s by reading out two out of four lines (3rd and 4th lines, 7th and 8th lines). the vertical resolution is approximately 400 tv-lines. this readout mode emphasizes processing speed over vertical resolution. 3. high frame rate readout two pixels addition mode all effective areas are scanned in approximately 1/30s by reading out two out of four lines (3rd and 4th lines, 7th and 8th lines), and by reading out two out of the remaining four lines (1st and 2nd lines, 5th and 6th lines) after shifting the vertical register by 2 bits, and adding them in the vertical register. image sensor characteristics measurement method
? 12 ? ICX267AL measurement conditions 1) in the following measurements, the device drive conditions are at the typical values of the progressive scan mode, bias and clock voltage conditions. 2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (ob) level is used as the reference for the signal output, and the value measured at point [*b] in the measurement system is used. definition of standard imaging conditions 1) standard imaging condition i : use a pattern box (luminance: 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f8. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) standard imaging condition i i : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity set to standard imaging condition i . after selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (v s ) at the center of the screen, and substitute the values into the following formulas. s = vs [mv] 2. saturation signal set to standard imaging condition i i . after adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 150mv, measure the minimum value of the signal output. 3. smear set to standard imaging condition i i . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 150mv. when the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value (vsm [mv]) of the signal output and substitute the value into the following formula. sm = 20 log [db] (1/10v method conversion value) 4. video signal shading set to standard imaging condition i i . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the signal output is 150mv. then measure the maximum (vrmax [mv]) and minimum (vrmin [mv]) values of the signal output and substitute the values into the following formula. sh = (vrmax ? vrmin)/150 100 [%] 250 30 1 10 1 500 vsm 150
? 13 ? ICX267AL 5. dark signal measure the average value of the signal output (vdt [mv]) with the device ambient temperature 60c and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. dark signal shading after measuring 5, measure the maximum (vdmax [mv]) and minimum (vdmin [mv]) values of the dark signal output and substitute the values into the following formula. ? vdt = vdmax ? vdmin [mv] 7. lag adjust the signal output value generated by strobe light to 150mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (vlag). substitute the value into the following formula. lag = (vlag/150) 100 [%] vd v2a strobe light timing output light signal output 150mv vlag (lag)
? 14 ? ICX267AL drive circuit 20 19 15v xv1 xv2a xsg1 xsub h2 h1 rg 1 2 3 4 5 6 7 8 9 10 19 18 17 16 15 14 13 12 11 cxd1267an 20 1/35v 100k h 2 h 1 rg v l nc gnd v dd 1 2 3 4 5 6 7 8 9 10 v 1 v 2a v 2b v 3 nc gnd nc v out 19 18 17 16 15 14 13 12 11 20 icx267 (bottom view) 0.1 22/16v 1m 0.1 2200p 22/20v 0.01 3.9k ccd out 2sk523 100 sub c sub nc ?8.0v xv3 xv2b xsg2 gnd nc 0.1 1 2 3 4 5 6 7 8 9 10 18 17 16 15 14 13 12 11 cxd1267an v sub cont. vr1 (1.3k) note) substrate bias control 1. connect the ground resistor (vr1) shown below to the c sub pin by each readout mode in order to secure the saturation signal described on the image sensor characteristics. ~ progressive scan readout mode : 2.0k ? y? ? ~ high frame rate readout mode : 3.8k ? y? ? ~ high frame rate 2 pixels addition mode: ground resistor should not be connected. ? 2. if the substrate bias control signal is set to high level, and the ground resistor (vr1) connected to c sub pin is not grounded at 55ms before the exposure time starts because tf is late, the internal generation voltage (v sub ) may not fall enough.substrate bias adjustment control signal v sub cont. tf 45ms tr 1ms gnd internal generation value v sub (v sub in high frame rate readout two pixels addition mode) 22/20v substrate bias adjustment control signal v sub cont. substrate bias sub pin voltage
? 15 ? ICX267AL sensor readout clock timing chart progressive scan mode xv1 xv2a/xv2b xv3 xsg1 the sensor readout clocks xsg1 and xsg2 are added to each xv2a and xv2b. hd v1 v2a v2b v3 27.9s (800 bits) 69.5ns (2 bits) 3.49s (100 bits) xsg2
? 16 ? ICX267AL sensor readout clock timing chart high frame rate readout mode 27.9s (800 bits) 69.5ns (2 bits) 3.49s (100 bits) xv1 xv2a/xv2b xv3 xsg1 hd v1 v2a v2b v3 xsg2 the sensor readout clock xsg2 is added to xv2b. 5.86s (168 bits)
? 17 ? ICX267AL sensor readout clock timing chart high frame rate readout two pixels addition mode xv1 xv2a/xv2b xv3 xsg1 the sensor readout clocks xsg1 and xsg2 are added to each xv2a and xv2b. hd v1 v2a v2b v3 xsg2 27.9s (800 bits) 69.5ns (2 bits) 3.49s (100 bits) 17.15s (492 bits) 28 98 2 282828282828282828282828282 98 5.86s (168 bits)
? 18 ? ICX267AL drive timing chart (vertical sync) progressive scan mode vd hd 1 2 3 4 5 6 7 8 9 10 11 12 21 1 13 1068 1063 1052 1044 1068 1063 v1 v2a v3 v2b ccd out 1234567812345 1234567812345 678910 1040 1040 1039 1038
? 19 ? ICX267AL drive timing chart (vertical sync) high frame rate readout mode 3 4 7 8 3 4 7 8 11 12 15 16 1 2 3 4 5 7 6 8 534 533 532 531 534 533 532 531 530 529 528 527 526 525 524 523 1039 1040 1035 1036 3 4 7 8 3 4 7 8 11 12 15 16 1 2 3 4 5 7 6 8 530 529 528 527 526 525 524 523 1039 1040 1035 1036 v 1 v 2a v 2b v 3 ccd out hd vd 534 533 532 1 2 3 4 5 7 6 8 531 3 4 7 8 3 4 7 8 11 12 15 16 1/30s 1/30s
? 20 ? ICX267AL drive timing chart (vertical sync) high frame rate readout two pixels addition mode 3 4 7 8 3 4 7 8 11 12 15 16 1 2 3 4 5 7 6 8 534 533 532 531 534 533 532 531 530 529 528 527 526 525 524 523 1039 1040 1035 1036 3 4 7 8 3 4 7 8 11 12 15 16 1 2 3 4 5 7 6 8 530 529 528 527 526 525 524 523 1039 1040 1035 1036 v 1 v 2a v 2b v 3 ccd out hd vd 534 533 532 1 2 3 4 5 7 6 8 531 3 4 7 8 3 4 7 8 11 12 15 16 1/30s 1/30s 1 2 5 6 1 2 5 6 9 10 13 14 1037 1038 1033 1034 1 2 5 6 1 2 5 6 9 10 13 14 1037 1038 1033 1034 1 2 5 6 1 2 5 6 9 10 13 14
? 21 ? ICX267AL drive timing chart (horizontal sync) progressive scan mode rg v 1 v 2a v 2b v 3 sub clk h 1 h 2 1790 1 56 392 412 430 1 1 1 1 168 1 168 112 56 1 56 56 1 1 112 1 188 1 168 168 1 112 1 1 36 1 112 hd 196 16 2
? 22 ? ICX267AL drive timing chart (horizontal sync) high frame rate readout mode rg v 1 v 2a v 2b v 3 sub clk h 1 h 2 1790 1 56 392 412 430 hd 196 16 2 1 1 1 1 84 28 1 28 1 36 1 84 84 1 1 56 28 1 84 1 56 56 1 84 1 1 112 188 184 1 84 84 1 84 1 84 1 84 1 84 1 84 1
? 23 ? ICX267AL drive timing chart (horizontal sync) high frame rate readout two pixels addition mode rg v 1 v 2a v 2b v 3 sub clk h 1 h 2 1790 1 56 392 412 430 hd 196 16 2 1 1 1 1 84 28 1 28 1 36 1 84 84 1 1 56 28 1 84 1 56 56 1 84 1 1 112 188 184 1 84 84 1 84 1 84 1 84 1 84 1 84 1
? 24 ? ICX267AL notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a ground 30w soldering iron and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero cross on/off type and connect it to ground. 3) dust and dirt protection image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. clean glass plates with the following operation as required, and use them. a) perform all assembly operations in a clean room (class 1000 or less). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) installing (attaching) a) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) plastic package cover glass compressive strength 50n 50n 1.2nm torsional strength b) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive.
? 25 ? ICX267AL c) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. e) if the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyano-acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) others a) do not expose to strong light (sun rays) for long periods. for continuous using under cruel condition exceeding the normal using condition, consult our company. b) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. c) the brown stain may be seen on the bottom or side of the package. but this does not affect the ccd characteristics.
? 26 ? ICX267AL package outline unit: mm sony corporation 20 pin dip b ~ b ' m a 1 1 c h v d 12.2 package structure package material lead treatment lead material package mass drawing number plastic gold plating 42 alloy as-b6-04(e) 0.95g 1. ?a? is the center of the effective image area. 2. the two points ?b? of the package are the horizontal reference. the point ?b'? of the package is the vertical reference. 3. the bottom ?c? of the package, and the top of the cover glass ?d? are the height reference. 4. the center of the effective image area relative to ?b? and ?b'? is (h, v) = (6.9, 6.0) 0.075mm. 5. the rotation angle of the effective image area relative to h and v is 1?. 6. the height from the bottom ?c? to the effective image area is 1.41 0.10mm. the height from the top of the cover glass ?d? to the effective image area is 1.49 0.15mm. 7. the tilt of the effective image area relative to the bottom ?c? is less than 50m. the tilt of the effective image area relative to the top ?d? of the cover glass is less than 50m. 8. the thickness of the cover glass is 0.5mm, and the refractive index is 1.5. 9. the notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. ~ ~ 1.7 11 20 1.7 10 13.8 0.1 12.7 10 20 11 6.9 10.9 0.8 1.27 0.3 0.3 10.0 2.5 0? to 9? 0.5 2.5 9.0 2.5 6.0 12.0 0.1 0.25 1.7 1.7 0.8 0.5 2.9 0.15 2.4 3.5 0.3

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